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Technology Roadmap

 

2012

2013

2014

Material

High TG FR4, PTFE

ROGERS

ROGERS

Max. finished board size (mm)

508mmx 584mm

508mmx 584mm

508mmx 584mm

Max. working panel size  (mm)

508mmx 610mm

533mm x 610mm

533mm x 622mm

Max. board thickness (mm)

4.8mm

5.6mm

6.4mm

CNC Drilling

 

 

Bury / Blind via hole

Blind via hole

Blind via hole

Blind via hole

Hole aspectration

10:01

10:01

12:01

Min. hole size

0.25mm

0.2mm

0.15mm

Finished hole diameter

+/-0.05mm

+/-0.04mm

+/-0.03mm

 

 

 

 

Inner layer

2007

2008

2009

Max. layer count

12

14

16

Max. copper thickness

3 oz

4 oz

4 oz

Target drilling tolerance

+/- 1.5mil

+/- 1.0mil

+/- 1.0mil

Layer to layer registration tolerance

+/- 1.0mil

+/- 1.0mil

+/- 1.0mil

Min. line width/space

0.10mm

0.08mm

0.08mm

Inner core thickness

0.065mm

0.06mm

0.06mm

Max. size

20” x 24”

21” x 24”

21” x 24”

Outer layer

 

 

 

BGA pitch

1.00mm

0.75mm

0.75mm

Max. copper thickness

5 oz

6 oz

6 oz

Min.  Line width/space

0.10mm

0.08mm

0.08mm

Surface finish

Pb Free HAL HAL/OSP/ENIG/Flash Au/Immersion Ag

Pb Free HAL

Pb Free HAL

HAS/OSP/ENIG/Flash Au Immersion Ag/Immersion Sn

HAS/OSP/ENIG/Flash Au Immersion Ag/Immersion Sn