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     Company Profile
     Introduction
     Milestone
     Company Mission
     Manufacturing Lead Time
     Quality Policy
     Commitment
     Sales Turnover
     Product Mix
     Market Mix
     Manufacturing Capability
     Technology Roadmap
     Equipment List
     Head Count

Manufacturing Capability

- Product: D/S & 4 - 12 Multi-layer PCB
- Board copper finishing: Electroplating Gold flash, Immersion Ni & Au, Hot-Air-Leveling, OSP, Lead Free HAL, Immersion Silver, Immersion Tin
- Min. board thickness: 0.25mm         
- Min. hole size: 0.15 mm (Finished)                        
- Min. conductor width: 0.1 mm          
- Min. spacing: 0.1 mm        
- Available Laminate: CEM-1, CEM-3, FR-4, Getek, PTFE, 25FR, Halogen Free Laminate
- Material supplier: Shengyi, Isola, Arlon, Taconic, King Board, ILM, Nelco, Rogers, ITEQ    
- Solder mask: Photo-imageable, Thermal Curing                   
- Base copper: 18um, 35um, 70um, 105um
- Max. panel size: 534mm x 650mm                 
- Capacity: 40,000 sq. M / month, D/S 20,000 sq. M / month, M/L 20,000 sq. M / month